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The global Leadframes market size was valued at USD 3508.35 Million in 2022 and will reach USD 4596.0 Million in 2028, with a CAGR of 4.6% during 2022-2028.
A leadframe is a thin layer of metal that is utilized in the semiconductor device assembly process. It is used to connect the large-scale circuitry on circuit boards and electrical devices to the tiny electrical terminals etched on the surface of the semiconductors.
Thus, leadframes are used to create most kinds of integrated circuit packaging. Basically, the silicon chip is placed on the lead frame and then metal leads of the lead frame are bonded to the chip. Finally, the connection is covered with plastic.
Often, the production of lead frames is customized according to the specifications, features, thermal properties, and electrical properties required by the client. Lead frames are created using two procedures – Etching and Stamping.
After a period of development, the industry is in a growth stage. With the continuous upgrading of products, the expansion of downstream industries and the development of technology and economy, the market continues to expand. Leadframes market is primarily a highly competitive international market. Market concentration is relatively moderate.
Insufficient supply, prolonged delivery cycle, rising prices
Affected by the epidemic, the trade war, and the recent Russia-Ukraine conflict, as well as the market's investment mismatch for wafer demand in the past few years, in recent two years, chips in many downstream fields such as automotive electronics, photovoltaics, home appliances, consumer electronics, and 5G communication terminals have been in a state of shortage. This shortage is not only on the wafer side, but also on the packaging and testing side. The demand for chips in the fields of electronics, photovoltaics, household appliances, etc. is more concentrated in power chips such as MOSFET, IGBT, MCU, etc. The packaging forms of these chips are still traditional packaging forms such as DIP (Dual in-line package), SOP (Small Out-Line Package), QFN (Quad Flat Package), etc. In the current global wave of core shortage, the demand for lead frames has increased, but the industry supply is far behind, and the industry has begun to show a market pattern of short supply. It is a foregone conclusion that the delivery time is constantly prolonged and the prices are rising quarter by quarter.
Downstream market demand growth
In recent years, the demand for lead frame packaging in automotive electronics, consumer electronics, communications, smart homes and other fields has been greatly increased, and the related fields have shown a tight supply situation, and products have begun to enter the boom cycle of rising prices. It is an indisputable fact that the automobile industry is undergoing electric transformation, and the future transportation mode will be cleaner and faster. Nowadays, consumers prefer sustainable and environmentally friendly lifestyles. Because of the epidemic, this phenomenon has become more obvious. For cars with different price grades, consumers are paying more and more attention to their environmental protection characteristics. The improvement of electrification, intelligence and networking of automobiles will directly drive the demand of related electronic hardware products, especially the demand for semiconductors. Therefore, the global automotive semiconductor market is expected to continue to increase, thus increasing the market demand for leadframes.
High industry barriers
At present, the production capacity of etched lead frames is mainly controlled by Japanese enterprises, while China and Taiwan-funded enterprises mainly compete in the field of stamping production technology. Even stamping production has a higher entry threshold, which is mainly reflected in the mold design capability, technological process capability and environmental protection threshold of electroplating process.
Etching process, with large capital investment and high entry threshold, mainly manufactures ultra-thin and multi-pin lead frames. In the die stamping production process, the die manufacturing cycle is longer, generally more than two to three months, and the supply cycle is longer. It is greatly influenced by the precision of stamping press and the advanced nature of die. High barriers to entry and high investment in expanding production affect the supply of leadframes, resulting in insufficient supply in the industry. In addition, in order to meet the product technical requirements of downstream customers and maintain product competitiveness, leadframes manufacturers need to increase R&D investment for equipment upgrade and process development accumulation for a long time.
Due to financial and technical barriers, manufacturers have low willingness to expand production. Due to the long capital recovery cycle, mature players in the industry are also cautious about capacity expansion.
Region Overview:
China had the highest growth rate of all regions.
Company Overview:
The major players operating in the Leadframes market include Mitsui High-tec, HAESUNG DS, Chang Wah Technology, SDI and Shinko, etc. Among which, Mitsui High-tec, ranked top in terms of sales and revenue in 2022.
Mitsui High-tec, Inc. engages in the production and sale of lead frame, motor core, precision tooling and machine tools. It operates through the following segments: Metal Molds, Electronic Components, Electrical Components, and Machine Tools. The Metal Molds segment manufactures and sells molds for press. The Electronic Components segment engages in the manufacture and sale of IC (Integrated Circuit) assembly and lead frame products. The Electrical Components segment handles the production of motor cores. The Machine Tools segment produces precision surface grinders.
Haesung DS has been a global leader in the semiconductor market since its establishment. Haesung DS business consists of lead frame and PKG substrates. Also most of Haesung DS products are exported to global semiconductor customers.
Segmentation Overview:
By type, Stamping Process Lead Frame segment accounted for the largest share of market in 2021.
Application Overview:
The market's largest segment by application is the segment Discrete Device, with a market share of 49.16% in 2021.
The Leadframes market report covers sufficient and comprehensive data on market introduction, segmentations, status and trends, opportunities and challenges, industry chain, competitive analysis, company profiles, and trade statistics, etc. It provides in-depth and all-scale analysis of each segment of types, applications, players, 5 major regions and sub-division of major countries, and sometimes end user, channel, technology, as well as other information individually tailored before order confirmation.
Meticulous research and analysis were conducted during the preparation process of the report. The qualitative and quantitative data were gained and verified through primary and secondary sources, which include but not limited to Magazines, Press Releases, Paid Databases, Maia Data Center, National Customs, Annual Reports, Public Databases, Expert interviews, etc. Besides, primary sources include extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs, and marketing executives, downstream distributors, as well as end-clients.
In this report, the historical period starts from 2018 to 2022, and the forecast period ranges from 2023 to 2028. The facts and data are demonstrated by tables, graphs, pie charts, and other pictorial representations, which enhances the effective visual representation and decision-making capabilities for business strategy.
Key Companies in the global Leadframes market covered in Chapter 4:
JIH LIN TECHNOLOGY
Dynacraft Industries
SDI
Fusheng Electronics
Mitsui High-tec
Kangqiang
POSSEHL
WuXi Micro Just-Tech
Chang Wah Technology
Jentech
HUAYANG ELECTRONIC
Advanced Assembly Materials International
QPL Limited
Shinko
HAESUNG DS
Enomoto
Hualong
In Chapter 12 and Chapter 14.1, on the basis of types, the Leadframes market from 2018 to 2028 is primarily split into:
Stamping Process Lead Frame
Etching Process Lead Frame
In Chapter 13 and Chapter 14.2, on the basis of the Downstream Industry, the Leadframes market from 2018 to 2028 covers:
Integrated Circuit
Discrete Device
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, history and forecast (2018-2028) of the following regions are covered in Chapters 6, 7, 8, 9, 10, 11, 15:
North America (United States, Canada, Mexico)
Europe (Germany, United Kingdom, France, Italy, Spain)
Asia Pacific (China, Japan, South Korea, India, Southeast Asia)
South America (Brazil, Argentina)
Middle East & Africa (Saudi Arabia, UAE, South Africa)
Outline:
Chapter 1 begins with the Leadframes market scope and definition, product segment introduction, global overall market size, as well as market dynamics scenarios such as opportunities, challenges, and industry development trends under inflation. It offers a high-level view of the current state of the Leadframes market and its likely evolution in the short to mid-term and long term.
Chapter 2 provides Leadframes industry chain analysis, covering raw materials analysis, cost structure, price estimate, and forecast, along with price-impacting factors, downstream channels, and major customers. It aims to help readers to grab insights into product upstream, midstream, and downstream fields.
Chapter 3 depicts Leadframes industry competitive analysis regarding market concentration rate, saturation rate, feasibility analysis from new entrants, as well as substitute's status and trends. It indicates the developing space and prospects of the current industry.
Chapter 4 analyzes extensive company profiles, comprising company basic info, product or service profiles, and sales, price, value, gross, and gross margin 2018-2023. It incorporates the Leadframes market ranking, benchmarks, and company business portfolio.
Chapter 5 presents trade statistics of import and export volume from 2018-2023, demonstrating domestic and international market comparisons in specific countries.
Chapters 6-10 highlight Leadframes market status at the regional and country levels, including 5 major regions of North America, Europe, Asia Pacific, the Middle East and Africa, and Latin America. The region and country list in the sample is only for reference, and it can be adjusted as required.
Chapter 11 involves geographical market figures of sales, value, market share, and growth rate. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of each specific region.
Chapters 12-13 evaluate the Leadframes market based on different types and applications. It focuses on sales and value of 2018-2023 from both vertical and horizontal perspectives.
Chapters 14-15 elaborate on the Leadframes market forecast data from 2023-2028, segmented by types and applications, regions, and major countries, helping readers to know future aspects and growth trends.
Chapter 16 ends with an elaboration of data sources and research methodology. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
2022
A leadframe is a thin layer of metal that is utilized in the semiconductor device assembly process. It is used to connect the large-scale circuitry on circuit boards and electrical devices to the tiny electrical terminals etched on the surface of the semiconductors.
Thus, leadframes are used to create most kinds of integrated circuit packaging. Basically, the silicon chip is placed on the lead frame and then metal leads of the lead frame are bonded to the chip. Finally, the connection is covered with plastic.
Often, the production of lead frames is customized according to the specifications, features, thermal properties, and electrical properties required by the client. Lead frames are created using two procedures – Etching and Stamping.
After a period of development, the industry is in a growth stage. With the continuous upgrading of products, the expansion of downstream industries and the development of technology and economy, the market continues to expand. Leadframes market is primarily a highly competitive international market. Market concentration is relatively moderate.
Insufficient supply, prolonged delivery cycle, rising prices
Affected by the epidemic, the trade war, and the recent Russia-Ukraine conflict, as well as the market's investment mismatch for wafer demand in the past few years, in recent two years, chips in many downstream fields such as automotive electronics, photovoltaics, home appliances, consumer electronics, and 5G communication terminals have been in a state of shortage. This shortage is not only on the wafer side, but also on the packaging and testing side. The demand for chips in the fields of electronics, photovoltaics, household appliances, etc. is more concentrated in power chips such as MOSFET, IGBT, MCU, etc. The packaging forms of these chips are still traditional packaging forms such as DIP (Dual in-line package), SOP (Small Out-Line Package), QFN (Quad Flat Package), etc. In the current global wave of core shortage, the demand for lead frames has increased, but the industry supply is far behind, and the industry has begun to show a market pattern of short supply. It is a foregone conclusion that the delivery time is constantly prolonged and the prices are rising quarter by quarter.
Downstream market demand growth
In recent years, the demand for lead frame packaging in automotive electronics, consumer electronics, communications, smart homes and other fields has been greatly increased, and the related fields have shown a tight supply situation, and products have begun to enter the boom cycle of rising prices. It is an indisputable fact that the automobile industry is undergoing electric transformation, and the future transportation mode will be cleaner and faster. Nowadays, consumers prefer sustainable and environmentally friendly lifestyles. Because of the epidemic, this phenomenon has become more obvious. For cars with different price grades, consumers are paying more and more attention to their environmental protection characteristics. The improvement of electrification, intelligence and networking of automobiles will directly drive the demand of related electronic hardware products, especially the demand for semiconductors. Therefore, the global automotive semiconductor market is expected to continue to increase, thus increasing the market demand for leadframes.
High industry barriers
At present, the production capacity of etched lead frames is mainly controlled by Japanese enterprises, while China and Taiwan-funded enterprises mainly compete in the field of stamping production technology. Even stamping production has a higher entry threshold, which is mainly reflected in the mold design capability, technological process capability and environmental protection threshold of electroplating process.
Etching process, with large capital investment and high entry threshold, mainly manufactures ultra-thin and multi-pin lead frames. In the die stamping production process, the die manufacturing cycle is longer, generally more than two to three months, and the supply cycle is longer. It is greatly influenced by the precision of stamping press and the advanced nature of die. High barriers to entry and high investment in expanding production affect the supply of leadframes, resulting in insufficient supply in the industry. In addition, in order to meet the product technical requirements of downstream customers and maintain product competitiveness, leadframes manufacturers need to increase R&D investment for equipment upgrade and process development accumulation for a long time.
Due to financial and technical barriers, manufacturers have low willingness to expand production. Due to the long capital recovery cycle, mature players in the industry are also cautious about capacity expansion.
Region Overview:
China had the highest growth rate of all regions.
Company Overview:
The major players operating in the Leadframes market include Mitsui High-tec, HAESUNG DS, Chang Wah Technology, SDI and Shinko, etc. Among which, Mitsui High-tec, ranked top in terms of sales and revenue in 2022.
Mitsui High-tec, Inc. engages in the production and sale of lead frame, motor core, precision tooling and machine tools. It operates through the following segments: Metal Molds, Electronic Components, Electrical Components, and Machine Tools. The Metal Molds segment manufactures and sells molds for press. The Electronic Components segment engages in the manufacture and sale of IC (Integrated Circuit) assembly and lead frame products. The Electrical Components segment handles the production of motor cores. The Machine Tools segment produces precision surface grinders.
Haesung DS has been a global leader in the semiconductor market since its establishment. Haesung DS business consists of lead frame and PKG substrates. Also most of Haesung DS products are exported to global semiconductor customers.
Segmentation Overview:
By type, Stamping Process Lead Frame segment accounted for the largest share of market in 2021.
Application Overview:
The market's largest segment by application is the segment Discrete Device, with a market share of 49.16% in 2021.
The Leadframes market report covers sufficient and comprehensive data on market introduction, segmentations, status and trends, opportunities and challenges, industry chain, competitive analysis, company profiles, and trade statistics, etc. It provides in-depth and all-scale analysis of each segment of types, applications, players, 5 major regions and sub-division of major countries, and sometimes end user, channel, technology, as well as other information individually tailored before order confirmation.
Meticulous research and analysis were conducted during the preparation process of the report. The qualitative and quantitative data were gained and verified through primary and secondary sources, which include but not limited to Magazines, Press Releases, Paid Databases, Maia Data Center, National Customs, Annual Reports, Public Databases, Expert interviews, etc. Besides, primary sources include extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs, and marketing executives, downstream distributors, as well as end-clients.
In this report, the historical period starts from 2018 to 2022, and the forecast period ranges from 2023 to 2028. The facts and data are demonstrated by tables, graphs, pie charts, and other pictorial representations, which enhances the effective visual representation and decision-making capabilities for business strategy.
Key Companies in the global Leadframes market covered in Chapter 4:
JIH LIN TECHNOLOGY
Dynacraft Industries
SDI
Fusheng Electronics
Mitsui High-tec
Kangqiang
POSSEHL
WuXi Micro Just-Tech
Chang Wah Technology
Jentech
HUAYANG ELECTRONIC
Advanced Assembly Materials International
QPL Limited
Shinko
HAESUNG DS
Enomoto
Hualong
In Chapter 12 and Chapter 14.1, on the basis of types, the Leadframes market from 2018 to 2028 is primarily split into:
Stamping Process Lead Frame
Etching Process Lead Frame
In Chapter 13 and Chapter 14.2, on the basis of the Downstream Industry, the Leadframes market from 2018 to 2028 covers:
Integrated Circuit
Discrete Device
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, history and forecast (2018-2028) of the following regions are covered in Chapters 6, 7, 8, 9, 10, 11, 15:
North America (United States, Canada, Mexico)
Europe (Germany, United Kingdom, France, Italy, Spain)
Asia Pacific (China, Japan, South Korea, India, Southeast Asia)
South America (Brazil, Argentina)
Middle East & Africa (Saudi Arabia, UAE, South Africa)
Outline:
Chapter 1 begins with the Leadframes market scope and definition, product segment introduction, global overall market size, as well as market dynamics scenarios such as opportunities, challenges, and industry development trends under inflation. It offers a high-level view of the current state of the Leadframes market and its likely evolution in the short to mid-term and long term.
Chapter 2 provides Leadframes industry chain analysis, covering raw materials analysis, cost structure, price estimate, and forecast, along with price-impacting factors, downstream channels, and major customers. It aims to help readers to grab insights into product upstream, midstream, and downstream fields.
Chapter 3 depicts Leadframes industry competitive analysis regarding market concentration rate, saturation rate, feasibility analysis from new entrants, as well as substitute's status and trends. It indicates the developing space and prospects of the current industry.
Chapter 4 analyzes extensive company profiles, comprising company basic info, product or service profiles, and sales, price, value, gross, and gross margin 2018-2023. It incorporates the Leadframes market ranking, benchmarks, and company business portfolio.
Chapter 5 presents trade statistics of import and export volume from 2018-2023, demonstrating domestic and international market comparisons in specific countries.
Chapters 6-10 highlight Leadframes market status at the regional and country levels, including 5 major regions of North America, Europe, Asia Pacific, the Middle East and Africa, and Latin America. The region and country list in the sample is only for reference, and it can be adjusted as required.
Chapter 11 involves geographical market figures of sales, value, market share, and growth rate. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of each specific region.
Chapters 12-13 evaluate the Leadframes market based on different types and applications. It focuses on sales and value of 2018-2023 from both vertical and horizontal perspectives.
Chapters 14-15 elaborate on the Leadframes market forecast data from 2023-2028, segmented by types and applications, regions, and major countries, helping readers to know future aspects and growth trends.
Chapter 16 ends with an elaboration of data sources and research methodology. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Years considered for this report:
Historical Years:
2018-2022Base Year:
2022Estimated Year:
2023Forecast Period:
2023-2028Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
