Pre-order Enquiry
Request Free Sample
Healthcare
Aerospace & Defence
Agriculture
Automations
Chemicals & Advanced Materials
Food & Beverages
Information & Communication Technology
Oil & Gas
Power & Energy
The global Electrostatic Chucks for Wafer market size was valued at USD 237.34 Million in 2022 and will reach USD 681.69 Million in 2028, with a CAGR of 19.23% during 2022-2028.
Electrostatic Chucks for Wafer are used in a variety of semiconductor processes to hold the wafer during processing. Electrostatic chucks employ a platen with integral electrodes which are biased with high voltage to establish an electrostatic holding force between the platen and wafer, thereby chucking the wafer.
Opportunities of Electrostatic Chucks for Wafer
The huge downstream market in the world, with active national industrial policies and active social capital, is supporting the development of the wafer industry from all angles and angles, and jointly promoting the steady progress of semiconductor supporting equipment such as electrostatic chucks for wafer. Development and growth have created opportunities.
Risk of Electrostatic Chucks for Wafer
The electrostatic chucks for wafer industry in many developing countries has been developed for a short period of time and is currently in its infancy, with weak market competitiveness. Except for a few international giants, most other companies are still in the research and development stage. Moreover, these companies are currently only able to repair and replace electrostatic chucks for wafer, which is not yet mature in terms of production.
Driving Force of Electrostatic Chucks for Wafer
The market's growing demand for consumer electronic products such as smart phones, tablets and other electronic devices is one of the main reasons for the rapid growth of the global electrostatic chucks for wafer market. Due to the growing demand for consumer electronic equipment, the number of wafer electronics factories worldwide has increased. The constantly changing wafer quality and dust-proof requirements in different electronic devices. This has also increased the demand for electrostatic chucks for wafer.
Region Overview:
Asia Pacific had the highest growth rate of all regions.
Company Overview:
SHINKO is one of the major players operating in the Electrostatic Chucks for Wafer market, holding a share of 28.60% in 2020.
SHINKO ELECTRIC INDUSTRIES CO., LTD. is a Japan-based semiconductor package manufacturer. The Company operates through two business segments. The Plastic Package segment is engaged in the development, manufacture and sale of plastic laminated packages (PLPs), as well as the assembly and sale of integrated circuits (ICs). The Metal Package segment manufactures and sells semiconductor lead frames, semiconductor glass-to-metal seals, heat spreaders and ceramic electrostatic chucks, among others.
Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Their expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. Their innovations make possible the technology shaping the future.
Segmentation Overview:
Among different product types, Coulomb Type Electrostatic Chucks segment is anticipated to contribute the largest market share in 2027.
Coulomb-type electrostatic chucks are considered to be a key technology for the next generation extreme-ultra-violet lithography. The electrostatic pressure holds the photo-mask during the fabrication process in vacuum. The field strength of the Coulomb type is lower than that of the J-R type because its dielectric thickness is thicker. The leakage current is little because the resistance of the dielectric layer is very high, so the voltage drop in the dielectric layer is almost the same as the source voltage. One of the advantages of this type is that residual clamping force can be eliminated relatively more easily after the applied voltage is cut off, because the charges are just induced by the electric field.
The Johnsen-Rahbek (JR) Type Electrostatic Chucks show some superior performances compared to the Coulomb type. The superiority is embodied in the stronger clamping force for a given clamping voltage (or lower clamping voltage required for the given clamping force), and relaxed material and machining criteria for dielectric manufacturing. A stronger clamping force could load higher back pressure; therefore, a higher heat-transfer capability can be achieved.
Application Overview:
By application, the 300 mm Wafer segment occupied the biggest share from 2017 to 2022.
The Electrostatic Chucks for Wafer market report covers sufficient and comprehensive data on market introduction, segmentations, status and trends, opportunities and challenges, industry chain, competitive analysis, company profiles, and trade statistics, etc. It provides in-depth and all-scale analysis of each segment of types, applications, players, 5 major regions and sub-division of major countries, and sometimes end user, channel, technology, as well as other information individually tailored before order confirmation.
Meticulous research and analysis were conducted during the preparation process of the report. The qualitative and quantitative data were gained and verified through primary and secondary sources, which include but not limited to Magazines, Press Releases, Paid Databases, Maia Data Center, National Customs, Annual Reports, Public Databases, Expert interviews, etc. Besides, primary sources include extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs, and marketing executives, downstream distributors, as well as end-clients.
In this report, the historical period starts from 2018 to 2022, and the forecast period ranges from 2023 to 2028. The facts and data are demonstrated by tables, graphs, pie charts, and other pictorial representations, which enhances the effective visual representation and decision-making capabilities for business strategy.
Key Companies in the global Electrostatic Chucks for Wafer market covered in Chapter 4:
II-VI M Cubed
TOTO
Creative Technology Corporation
Applied Materials
SHINKO
FM Industries
Tsukuba Seiko
Kyocera
NTK CERATEC
In Chapter 12 and Chapter 14.1, on the basis of types, the Electrostatic Chucks for Wafer market from 2018 to 2028 is primarily split into:
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks
In Chapter 13 and Chapter 14.2, on the basis of the Downstream Industry, the Electrostatic Chucks for Wafer market from 2018 to 2028 covers:
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, history and forecast (2018-2028) of the following regions are covered in Chapters 6, 7, 8, 9, 10, 11, 15:
North America (United States, Canada, Mexico)
Europe (Germany, United Kingdom, France, Italy, Spain)
Asia Pacific (China, Japan, South Korea, India, Southeast Asia)
South America (Brazil, Argentina)
Middle East & Africa (Saudi Arabia, UAE, South Africa)
Outline:
Chapter 1 begins with the Electrostatic Chucks for Wafer market scope and definition, product segment introduction, global overall market size, as well as market dynamics scenarios such as opportunities, challenges, and industry development trends under inflation. It offers a high-level view of the current state of the Electrostatic Chucks for Wafer market and its likely evolution in the short to mid-term and long term.
Chapter 2 provides Electrostatic Chucks for Wafer industry chain analysis, covering raw materials analysis, cost structure, price estimate, and forecast, along with price-impacting factors, downstream channels, and major customers. It aims to help readers to grab insights into product upstream, midstream, and downstream fields.
Chapter 3 depicts Electrostatic Chucks for Wafer industry competitive analysis regarding market concentration rate, saturation rate, feasibility analysis from new entrants, as well as substitute's status and trends. It indicates the developing space and prospects of the current industry.
Chapter 4 analyzes extensive company profiles, comprising company basic info, product or service profiles, and sales, price, value, gross, and gross margin 2018-2023. It incorporates the Electrostatic Chucks for Wafer market ranking, benchmarks, and company business portfolio.
Chapter 5 presents trade statistics of import and export volume from 2018-2023, demonstrating domestic and international market comparisons in specific countries.
Chapters 6-10 highlight Electrostatic Chucks for Wafer market status at the regional and country levels, including 5 major regions of North America, Europe, Asia Pacific, the Middle East and Africa, and Latin America. The region and country list in the sample is only for reference, and it can be adjusted as required.
Chapter 11 involves geographical market figures of sales, value, market share, and growth rate. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of each specific region.
Chapters 12-13 evaluate the Electrostatic Chucks for Wafer market based on different types and applications. It focuses on sales and value of 2018-2023 from both vertical and horizontal perspectives.
Chapters 14-15 elaborate on the Electrostatic Chucks for Wafer market forecast data from 2023-2028, segmented by types and applications, regions, and major countries, helping readers to know future aspects and growth trends.
Chapter 16 ends with an elaboration of data sources and research methodology. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
2022
Electrostatic Chucks for Wafer are used in a variety of semiconductor processes to hold the wafer during processing. Electrostatic chucks employ a platen with integral electrodes which are biased with high voltage to establish an electrostatic holding force between the platen and wafer, thereby chucking the wafer.
Opportunities of Electrostatic Chucks for Wafer
The huge downstream market in the world, with active national industrial policies and active social capital, is supporting the development of the wafer industry from all angles and angles, and jointly promoting the steady progress of semiconductor supporting equipment such as electrostatic chucks for wafer. Development and growth have created opportunities.
Risk of Electrostatic Chucks for Wafer
The electrostatic chucks for wafer industry in many developing countries has been developed for a short period of time and is currently in its infancy, with weak market competitiveness. Except for a few international giants, most other companies are still in the research and development stage. Moreover, these companies are currently only able to repair and replace electrostatic chucks for wafer, which is not yet mature in terms of production.
Driving Force of Electrostatic Chucks for Wafer
The market's growing demand for consumer electronic products such as smart phones, tablets and other electronic devices is one of the main reasons for the rapid growth of the global electrostatic chucks for wafer market. Due to the growing demand for consumer electronic equipment, the number of wafer electronics factories worldwide has increased. The constantly changing wafer quality and dust-proof requirements in different electronic devices. This has also increased the demand for electrostatic chucks for wafer.
Region Overview:
Asia Pacific had the highest growth rate of all regions.
Company Overview:
SHINKO is one of the major players operating in the Electrostatic Chucks for Wafer market, holding a share of 28.60% in 2020.
SHINKO ELECTRIC INDUSTRIES CO., LTD. is a Japan-based semiconductor package manufacturer. The Company operates through two business segments. The Plastic Package segment is engaged in the development, manufacture and sale of plastic laminated packages (PLPs), as well as the assembly and sale of integrated circuits (ICs). The Metal Package segment manufactures and sells semiconductor lead frames, semiconductor glass-to-metal seals, heat spreaders and ceramic electrostatic chucks, among others.
Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Their expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. Their innovations make possible the technology shaping the future.
Segmentation Overview:
Among different product types, Coulomb Type Electrostatic Chucks segment is anticipated to contribute the largest market share in 2027.
Coulomb-type electrostatic chucks are considered to be a key technology for the next generation extreme-ultra-violet lithography. The electrostatic pressure holds the photo-mask during the fabrication process in vacuum. The field strength of the Coulomb type is lower than that of the J-R type because its dielectric thickness is thicker. The leakage current is little because the resistance of the dielectric layer is very high, so the voltage drop in the dielectric layer is almost the same as the source voltage. One of the advantages of this type is that residual clamping force can be eliminated relatively more easily after the applied voltage is cut off, because the charges are just induced by the electric field.
The Johnsen-Rahbek (JR) Type Electrostatic Chucks show some superior performances compared to the Coulomb type. The superiority is embodied in the stronger clamping force for a given clamping voltage (or lower clamping voltage required for the given clamping force), and relaxed material and machining criteria for dielectric manufacturing. A stronger clamping force could load higher back pressure; therefore, a higher heat-transfer capability can be achieved.
Application Overview:
By application, the 300 mm Wafer segment occupied the biggest share from 2017 to 2022.
The Electrostatic Chucks for Wafer market report covers sufficient and comprehensive data on market introduction, segmentations, status and trends, opportunities and challenges, industry chain, competitive analysis, company profiles, and trade statistics, etc. It provides in-depth and all-scale analysis of each segment of types, applications, players, 5 major regions and sub-division of major countries, and sometimes end user, channel, technology, as well as other information individually tailored before order confirmation.
Meticulous research and analysis were conducted during the preparation process of the report. The qualitative and quantitative data were gained and verified through primary and secondary sources, which include but not limited to Magazines, Press Releases, Paid Databases, Maia Data Center, National Customs, Annual Reports, Public Databases, Expert interviews, etc. Besides, primary sources include extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs, and marketing executives, downstream distributors, as well as end-clients.
In this report, the historical period starts from 2018 to 2022, and the forecast period ranges from 2023 to 2028. The facts and data are demonstrated by tables, graphs, pie charts, and other pictorial representations, which enhances the effective visual representation and decision-making capabilities for business strategy.
Key Companies in the global Electrostatic Chucks for Wafer market covered in Chapter 4:
II-VI M Cubed
TOTO
Creative Technology Corporation
Applied Materials
SHINKO
FM Industries
Tsukuba Seiko
Kyocera
NTK CERATEC
In Chapter 12 and Chapter 14.1, on the basis of types, the Electrostatic Chucks for Wafer market from 2018 to 2028 is primarily split into:
Coulomb Type Electrostatic Chucks
Johnsen-Rahbek (JR) Type Electrostatic Chucks
In Chapter 13 and Chapter 14.2, on the basis of the Downstream Industry, the Electrostatic Chucks for Wafer market from 2018 to 2028 covers:
300 mm Wafer
200 mm Wafer
150 mm Wafer
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, history and forecast (2018-2028) of the following regions are covered in Chapters 6, 7, 8, 9, 10, 11, 15:
North America (United States, Canada, Mexico)
Europe (Germany, United Kingdom, France, Italy, Spain)
Asia Pacific (China, Japan, South Korea, India, Southeast Asia)
South America (Brazil, Argentina)
Middle East & Africa (Saudi Arabia, UAE, South Africa)
Outline:
Chapter 1 begins with the Electrostatic Chucks for Wafer market scope and definition, product segment introduction, global overall market size, as well as market dynamics scenarios such as opportunities, challenges, and industry development trends under inflation. It offers a high-level view of the current state of the Electrostatic Chucks for Wafer market and its likely evolution in the short to mid-term and long term.
Chapter 2 provides Electrostatic Chucks for Wafer industry chain analysis, covering raw materials analysis, cost structure, price estimate, and forecast, along with price-impacting factors, downstream channels, and major customers. It aims to help readers to grab insights into product upstream, midstream, and downstream fields.
Chapter 3 depicts Electrostatic Chucks for Wafer industry competitive analysis regarding market concentration rate, saturation rate, feasibility analysis from new entrants, as well as substitute's status and trends. It indicates the developing space and prospects of the current industry.
Chapter 4 analyzes extensive company profiles, comprising company basic info, product or service profiles, and sales, price, value, gross, and gross margin 2018-2023. It incorporates the Electrostatic Chucks for Wafer market ranking, benchmarks, and company business portfolio.
Chapter 5 presents trade statistics of import and export volume from 2018-2023, demonstrating domestic and international market comparisons in specific countries.
Chapters 6-10 highlight Electrostatic Chucks for Wafer market status at the regional and country levels, including 5 major regions of North America, Europe, Asia Pacific, the Middle East and Africa, and Latin America. The region and country list in the sample is only for reference, and it can be adjusted as required.
Chapter 11 involves geographical market figures of sales, value, market share, and growth rate. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of each specific region.
Chapters 12-13 evaluate the Electrostatic Chucks for Wafer market based on different types and applications. It focuses on sales and value of 2018-2023 from both vertical and horizontal perspectives.
Chapters 14-15 elaborate on the Electrostatic Chucks for Wafer market forecast data from 2023-2028, segmented by types and applications, regions, and major countries, helping readers to know future aspects and growth trends.
Chapter 16 ends with an elaboration of data sources and research methodology. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Years considered for this report:
Historical Years:
2018-2022Base Year:
2022Estimated Year:
2023Forecast Period:
2023-2028Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
