Pre-order Enquiry
Request Free Sample
Healthcare
Aerospace & Defence
Agriculture
Automations
Chemicals & Advanced Materials
Food & Beverages
Information & Communication Technology
Oil & Gas
Power & Energy
According to the latest research, the global Aluminum Bonding Wires market size was valued at USD 174.58 million in 2022 and is expected to expand at a CAGR of 4.78% during the forecast period, reaching USD 231.04 million by 2028.
Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) and silicon chips using bonding wires, which are fine wires made of materials such as gold and aluminium. The two most common processes are gold bonding and aluminium bonding. Aluminum wire bonding is pure friction welding. Two pure metals are pressed together using a specific amount of pressure and are friction welded with ultrasonic oscillation that is generated by a transducer.
Market Drivers & Growth Opportunities
Wire bonding is an extremely critical step in chip packaging. It is mainly used in the traditional packaging field. It has the advantages of strong reliability and low cost. It is widely used in logic, power, simulation and other mature processes and memory chip stacking. Advanced packaging is required for high-precision or special-performance chips, but it is difficult to fully popularize advanced packaging due to technical difficulties and development costs, so wire bonding is still the mainstream connection method. According to SEMI's statistics on global semiconductor packaging equipment from 2006 to 2018, packaging equipment accounted for about 8% of the total semiconductor equipment market, and the global packaging equipment market was about 5.7 billion US dollars. According to SEMI data, wire bonding equipment accounts for about 1/3 of the investment in packaging equipment.
The bonding wire is used in the wire bonding process, and the bonding wire is one of the four essential basic materials (chips, frames, bonding wires, and sealing materials) in the semiconductor discrete device and integrated circuit (IC) packaging industry. The inner lead between them can achieve stable and reliable electrical connection, with good mechanical properties, electrical properties and stability of the second solder joint, and is widely used in semiconductor discrete devices (transistors, diodes, triodes, light-emitting diodes, LEDs, etc.) and integrated circuits package. Therefore, the market development of the bonding wire industry is also an important basis for the development of Aluminum Bonding Wires products.
Aluminum Bonding Wires are economical and widely used in power semiconductors. The key bonding materials are subdivided. At present, the commonly used bonding wires are aluminum wire, gold wire, silver wire, copper wire, aluminum tape, copper sheet and aluminum-clad copper wire, etc. The earliest gold wire bonding has the highest penetration rate, but the price of gold wire It is high, and it is easy to cause wire collapse, tailing and aging. With the increase of economic demand, how to reduce costs while stabilizing or even improving bonding performance has become one of the difficulties for wire bonding to be overcome. Subsequently, various low-cost bonding methods such as gold-plated silver wire, silver wire, copper wire, and aluminum wire gradually replaced the market share of gold wire. Among them, Aluminum Bonding Wires, relying on good economy and relatively mature technology, are widely used in power semiconductor devices. (Insulated Gate Bipolar Transistor (IGBT), metal–oxide–semiconductor field-effect transistor (MOSFET), Uninterruptible Power Supplies (UPS), power transistor). With the rise of high-power control industries such as rail transit, high-speed rail power, aerospace, ship drive, smart grid, new energy, AC frequency conversion, wind power generation, electric vehicles, etc., it is known as the representative product of the third technological revolution of power devices Insulated Gate Bipolar Transistor (IGBT) products are widely used, the market size of Aluminum Bonding Wires still maintains a growth momentum, and the penetration rate of Aluminum Bonding Wires technology is expected to further increase.
Region Overview:
From 2022-2027, Asia Pacific is estimated to witness robust growth prospects.
Company Overview:
The top three companies are Heraeus, Tanaka, Yantai Yesdo Electronic Materials with the revenue market share of 45.32%, 16.96%, 2.88% in 2021.
Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned portfolio company. The Heraeus group includes businesses in the environmental, electronics, health and industrial applications sectors.
Since its foundation in 1885, TANAKA Precious Metals has built a diversified range of business activities focused on precious metals. Main businesses:
Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products.
Segmentation Overview:
Among different product types, Small Diameter Aluminum Wires segment is anticipated to contribute the largest market share in 2027.
Application Overview:
By application, the Automotive Electronics segment occupied the biggest share from 2017 to 2022.
This report elaborates on the market size, market characteristics, and market growth of the Aluminum Bonding Wires industry between the year 2018 to 2028, and breaks down according to the product type, downstream application, and consumption area of Aluminum Bonding Wires. The report also introduces players in the industry from the perspective of the value chain and looks into the leading companies.
Key Points this Global Aluminum Bonding Wires Market Report Include:
Market Size Estimates: Aluminum Bonding Wires market size estimation in terms of revenue and sales from 2018-2028
Market Dynamic and Trends: Aluminum Bonding Wires market drivers, restraints, opportunities, and challenges
Macro-economy and Regional Conflict: Influence of global inflation and Russia & Ukraine War on the Aluminum Bonding Wires market
Segment Market Analysis: Aluminum Bonding Wires market revenue and sales by type and by application from 2018-2028
Regional Market Analysis: Aluminum Bonding Wires market situations and prospects in major and top regions and countries
Aluminum Bonding Wires Market
Aluminum Bonding Wires Industry Chain: Aluminum Bonding Wires market raw materials & suppliers, manufacturing process, distributors by region, downstream customers
Aluminum Bonding Wires Industry News, Policies by regions
Aluminum Bonding Wires Industry Porters Five Forces Analysis
Key players in the global Aluminum Bonding Wires market are covered in Chapter 2:
Ametek
Heraeus
Custom Chip Connections
Tanaka
Nichetech
Yantai Yesdo Electronic Materials
World Star Electronic Material Co.,Ltd.
In Chapter 6 and Chapter 9, on the basis of types, the Aluminum Bonding Wires market from 2018 to 2028 is primarily split into:
Small Diameter Aluminum Wires
Large Diameter Aluminum Wires
In Chapter 7 and Chapter 10, on the basis of applications, the Aluminum Bonding Wires market from 2018 to 2028 covers:
Automotive Electronics
Consumer Electronics
Power Supplies
Computing Equipment
Industrial
Military & Aerospace
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate of the following regions from 2018 to 2028 are covered in Chapter 8 and Chapter 11:
United States
Europe
China
Japan
India
Southeast Asia
Latin America
Middle East and Africa
Others
In summary, this report relies on sources from both primary and secondary, combines comprehensive quantitative analysis with detailed qualitative analysis, and pictures the market from a macro overview to micro granular segment aspects. Whatever your role in this industry value chain is, you should benefit from this report with no doubt.
Chapter Outline
This report consists of 12 chapters. Below is a brief guideline to help you quickly grasp the main contents of each chapter:
Chapter 1 first introduces the product overview, market scope, product classification, application, and regional division, and then summarizes the global Aluminum Bonding Wires market size in terms of revenue, sales volume, and average price.
Chapter 2 analyzes the main companies in the Aluminum Bonding Wires industry, including their main businesses, products/services, sales, prices, revenue, gross profit margin, and the latest developments/updates.
Chapter 3 is an analysis of the competitive environment of Aluminum Bonding Wires market participants. This mainly includes the revenue, sales, market share, and average price of the top players, along with the market concentration ratio in 2022 and the players' M&A and expansion in recent years.
Chapter 4 is an analysis of the Aluminum Bonding Wires industrial chain, including raw material analysis, manufacturing cost structure, distributors, and major downstream buyers.
Chapter 5 focuses on Aluminum Bonding Wires market dynamics and marketing strategy analysis, which include opportunities, challenges, industry development trends under inflation, industry news and policies analyzed by region, Porter's Five Forces analysis, as well as direct and indirect marketing, and the development trends of marketing channels.
Chapters 6-8 have segmented the Aluminum Bonding Wires market by type, application, and region, with a focus on sales and value from 2018 to 2023 from both vertical and horizontal perspectives.
Chapters 9-11 provide detailed Aluminum Bonding Wires market forecast data for 2023-2028, broken down by type and application, region, and major countries to help understand future growth trends.
Chapter 12 concludes with an explanation of the data sources and research methods. Verify and analyze through preliminary research to obtain final quantitative and qualitative data.
2022
Wire bonding is the process of creating electrical interconnections between semiconductors (or other integrated circuits) and silicon chips using bonding wires, which are fine wires made of materials such as gold and aluminium. The two most common processes are gold bonding and aluminium bonding. Aluminum wire bonding is pure friction welding. Two pure metals are pressed together using a specific amount of pressure and are friction welded with ultrasonic oscillation that is generated by a transducer.
Market Drivers & Growth Opportunities
Wire bonding is an extremely critical step in chip packaging. It is mainly used in the traditional packaging field. It has the advantages of strong reliability and low cost. It is widely used in logic, power, simulation and other mature processes and memory chip stacking. Advanced packaging is required for high-precision or special-performance chips, but it is difficult to fully popularize advanced packaging due to technical difficulties and development costs, so wire bonding is still the mainstream connection method. According to SEMI's statistics on global semiconductor packaging equipment from 2006 to 2018, packaging equipment accounted for about 8% of the total semiconductor equipment market, and the global packaging equipment market was about 5.7 billion US dollars. According to SEMI data, wire bonding equipment accounts for about 1/3 of the investment in packaging equipment.
The bonding wire is used in the wire bonding process, and the bonding wire is one of the four essential basic materials (chips, frames, bonding wires, and sealing materials) in the semiconductor discrete device and integrated circuit (IC) packaging industry. The inner lead between them can achieve stable and reliable electrical connection, with good mechanical properties, electrical properties and stability of the second solder joint, and is widely used in semiconductor discrete devices (transistors, diodes, triodes, light-emitting diodes, LEDs, etc.) and integrated circuits package. Therefore, the market development of the bonding wire industry is also an important basis for the development of Aluminum Bonding Wires products.
Aluminum Bonding Wires are economical and widely used in power semiconductors. The key bonding materials are subdivided. At present, the commonly used bonding wires are aluminum wire, gold wire, silver wire, copper wire, aluminum tape, copper sheet and aluminum-clad copper wire, etc. The earliest gold wire bonding has the highest penetration rate, but the price of gold wire It is high, and it is easy to cause wire collapse, tailing and aging. With the increase of economic demand, how to reduce costs while stabilizing or even improving bonding performance has become one of the difficulties for wire bonding to be overcome. Subsequently, various low-cost bonding methods such as gold-plated silver wire, silver wire, copper wire, and aluminum wire gradually replaced the market share of gold wire. Among them, Aluminum Bonding Wires, relying on good economy and relatively mature technology, are widely used in power semiconductor devices. (Insulated Gate Bipolar Transistor (IGBT), metal–oxide–semiconductor field-effect transistor (MOSFET), Uninterruptible Power Supplies (UPS), power transistor). With the rise of high-power control industries such as rail transit, high-speed rail power, aerospace, ship drive, smart grid, new energy, AC frequency conversion, wind power generation, electric vehicles, etc., it is known as the representative product of the third technological revolution of power devices Insulated Gate Bipolar Transistor (IGBT) products are widely used, the market size of Aluminum Bonding Wires still maintains a growth momentum, and the penetration rate of Aluminum Bonding Wires technology is expected to further increase.
Region Overview:
From 2022-2027, Asia Pacific is estimated to witness robust growth prospects.
Company Overview:
The top three companies are Heraeus, Tanaka, Yantai Yesdo Electronic Materials with the revenue market share of 45.32%, 16.96%, 2.88% in 2021.
Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned portfolio company. The Heraeus group includes businesses in the environmental, electronics, health and industrial applications sectors.
Since its foundation in 1885, TANAKA Precious Metals has built a diversified range of business activities focused on precious metals. Main businesses:
Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products.
Segmentation Overview:
Among different product types, Small Diameter Aluminum Wires segment is anticipated to contribute the largest market share in 2027.
Application Overview:
By application, the Automotive Electronics segment occupied the biggest share from 2017 to 2022.
This report elaborates on the market size, market characteristics, and market growth of the Aluminum Bonding Wires industry between the year 2018 to 2028, and breaks down according to the product type, downstream application, and consumption area of Aluminum Bonding Wires. The report also introduces players in the industry from the perspective of the value chain and looks into the leading companies.
Key Points this Global Aluminum Bonding Wires Market Report Include:
Market Size Estimates: Aluminum Bonding Wires market size estimation in terms of revenue and sales from 2018-2028
Market Dynamic and Trends: Aluminum Bonding Wires market drivers, restraints, opportunities, and challenges
Macro-economy and Regional Conflict: Influence of global inflation and Russia & Ukraine War on the Aluminum Bonding Wires market
Segment Market Analysis: Aluminum Bonding Wires market revenue and sales by type and by application from 2018-2028
Regional Market Analysis: Aluminum Bonding Wires market situations and prospects in major and top regions and countries
Aluminum Bonding Wires Market
Competitive Landscape
and Major Players: Analysis of 10-15 leading market players, sales, price, revenue, gross, gross margin, product/service profile and recent development/updates, etc.Aluminum Bonding Wires Industry Chain: Aluminum Bonding Wires market raw materials & suppliers, manufacturing process, distributors by region, downstream customers
Aluminum Bonding Wires Industry News, Policies by regions
Aluminum Bonding Wires Industry Porters Five Forces Analysis
Key players in the global Aluminum Bonding Wires market are covered in Chapter 2:
Ametek
Heraeus
Custom Chip Connections
Tanaka
Nichetech
Yantai Yesdo Electronic Materials
World Star Electronic Material Co.,Ltd.
In Chapter 6 and Chapter 9, on the basis of types, the Aluminum Bonding Wires market from 2018 to 2028 is primarily split into:
Small Diameter Aluminum Wires
Large Diameter Aluminum Wires
In Chapter 7 and Chapter 10, on the basis of applications, the Aluminum Bonding Wires market from 2018 to 2028 covers:
Automotive Electronics
Consumer Electronics
Power Supplies
Computing Equipment
Industrial
Military & Aerospace
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate of the following regions from 2018 to 2028 are covered in Chapter 8 and Chapter 11:
United States
Europe
China
Japan
India
Southeast Asia
Latin America
Middle East and Africa
Others
In summary, this report relies on sources from both primary and secondary, combines comprehensive quantitative analysis with detailed qualitative analysis, and pictures the market from a macro overview to micro granular segment aspects. Whatever your role in this industry value chain is, you should benefit from this report with no doubt.
Chapter Outline
This report consists of 12 chapters. Below is a brief guideline to help you quickly grasp the main contents of each chapter:
Chapter 1 first introduces the product overview, market scope, product classification, application, and regional division, and then summarizes the global Aluminum Bonding Wires market size in terms of revenue, sales volume, and average price.
Chapter 2 analyzes the main companies in the Aluminum Bonding Wires industry, including their main businesses, products/services, sales, prices, revenue, gross profit margin, and the latest developments/updates.
Chapter 3 is an analysis of the competitive environment of Aluminum Bonding Wires market participants. This mainly includes the revenue, sales, market share, and average price of the top players, along with the market concentration ratio in 2022 and the players' M&A and expansion in recent years.
Chapter 4 is an analysis of the Aluminum Bonding Wires industrial chain, including raw material analysis, manufacturing cost structure, distributors, and major downstream buyers.
Chapter 5 focuses on Aluminum Bonding Wires market dynamics and marketing strategy analysis, which include opportunities, challenges, industry development trends under inflation, industry news and policies analyzed by region, Porter's Five Forces analysis, as well as direct and indirect marketing, and the development trends of marketing channels.
Chapters 6-8 have segmented the Aluminum Bonding Wires market by type, application, and region, with a focus on sales and value from 2018 to 2023 from both vertical and horizontal perspectives.
Chapters 9-11 provide detailed Aluminum Bonding Wires market forecast data for 2023-2028, broken down by type and application, region, and major countries to help understand future growth trends.
Chapter 12 concludes with an explanation of the data sources and research methods. Verify and analyze through preliminary research to obtain final quantitative and qualitative data.
Years considered for this report:
Historical Years:
2018-2022Base Year:
2022Estimated Year:
2023Forecast Period:
2023-2028Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
