Global Advanced Packaging Market Research Report 2022

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

Market Analysis and Insights: Global Advanced Packaging Market

Due to the COVID-19 pandemic, the global Advanced Packaging market size is estimated to be worth US$ 15930 million in 2022 and is forecast to a readjusted size of US$ 23240 million by 2028 with a CAGR of 6.5% during the forecast period 2022-2028. Fully considering the economic change by this health crisis, 3.0 DIC accounting for % of the Advanced Packaging global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Analog & Mixed Signal segment is altered to an % CAGR throughout this forecast period.

ASE, Amkor, SPIL, Stats Chippac, PTI, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa and NEPES are the key manufacturters of Advanced Packaging.

Global Advanced Packaging Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Advanced Packaging Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.


Segment by Type


3.0 DIC

FO SIP

FO WLP

3D WLP

WLCSP

2.5D

Filp Chip


Segment by Application


Analog & Mixed Signal

Wireless Connectivity

Optoelectronic

MEMS & Sensor

Misc Logic and Memory

Other


By Company


ASE

Amkor

SPIL

Stats Chippac

PTI

JCET

J-Devices

UTAC

Chipmos

Chipbond

STS

Huatian

NFM

Carsem

Walton

Unisem

OSE

AOI

Formosa

NEPES


Production by Region



North America

Europe

Southeast Asia

Japan

China

Taiwan (China)


Consumption by Region


North America

U.S.

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

India

Australia

Taiwan

Indonesia

Thailand

Malaysia

Philippines

Vietnam

Latin America

Mexico

Brazil

Argentina

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