Global and United States FC-BGA Substrates Market Report & Forecast 2022-2028

FC-BGA (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions.
Market Analysis and Insights: Global and United States FC-BGA Substrates Market
This report focuses on global and United States FC-BGA Substrates market, also covers the segmentation data of other regions in regional level and county level.
Due to the COVID-19 pandemic, the global FC-BGA Substrates market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, by Type, Core Thickness: 400-1200 μm accounting for % of the FC-BGA Substrates global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Application, Network Device (ASIC) was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
In United States the FC-BGA Substrates market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period.
Global FC-BGA Substrates Scope and Market Size
FC-BGA Substrates market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global FC-BGA Substrates market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the FC-BGA Substrates market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type
Core Thickness: 400-1200 μm
Core Thickness: 1200-1400 μm
Othes
Segment by Application
Network Device (ASIC)
Server/PC (CPU)
AI Processor
Automotive (Infotainment / ADAS)
Home Game Console (SoC)
Graphic Processing Unit (GPU)
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
By Company
Toppan
KYOCERA
Alcanta
Fujitsu
Samsung Electro-Mechanics
Panasonic
LG Innotek
SHINKO
Unimicron
Ibiden
Nan Ya Printed Circuit Board
Kinsus Interconnect
AT&S

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