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BGT(Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
Market Analysis and Insights: Global Back Grinding Tapes Market
Due to the COVID-19 pandemic, the global Back Grinding Tapes market size is estimated to be worth US$ 219.5 million in 2022 and is forecast to a readjusted size of US$ 299.3 million by 2028 with a CAGR of 5.3% during the forecast period 2022-2028. Fully considering the economic change by this health crisis, UV Type accounting for % of the Back Grinding Tapes global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Standard segment is altered to an % CAGR throughout this forecast period.
Japan is the largest market with about 41% market share. Southeast Asia is follower, accounting for about 15% market share.
The key players are Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology etc. Top 3 companies occupied about 70% market share.
Global Back Grinding Tapes Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Back Grinding Tapes Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
UV Type
Non-UV Type
Segment by Application
Standard
Standard Thin Die
(S)DBG (GAL)
Bump
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Production by Region
Japan
North America
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Market Analysis and Insights: Global Back Grinding Tapes Market
Due to the COVID-19 pandemic, the global Back Grinding Tapes market size is estimated to be worth US$ 219.5 million in 2022 and is forecast to a readjusted size of US$ 299.3 million by 2028 with a CAGR of 5.3% during the forecast period 2022-2028. Fully considering the economic change by this health crisis, UV Type accounting for % of the Back Grinding Tapes global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Standard segment is altered to an % CAGR throughout this forecast period.
Japan is the largest market with about 41% market share. Southeast Asia is follower, accounting for about 15% market share.
The key players are Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology etc. Top 3 companies occupied about 70% market share.
Global Back Grinding Tapes Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Back Grinding Tapes Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
UV Type
Non-UV Type
Segment by Application
Standard
Standard Thin Die
(S)DBG (GAL)
Bump
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
Production by Region
Japan
North America
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
