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The Laser Direct Imaging (LDI) Equipment offers auto focus capabilities so that the system can handle different thicknesses of material and rapid job change-overs without expensive tooling. Using LDI to create the circuit traces gives the PCB manufacturers a lot of advantages, most of them pertaining to weaknesses of using a Photo-tool. Eliminating the need of a Photo-tool removes alignment issues, light refraction issues, and those imperfections related to environmental variations. Also, with LDI, PCB factories can achieve the development of images that require more precision, and resolution, due to the computer's enhanced optical alignment, that automatically compensates distortion on the materials. Changes to the required images, are also easier to achieve with LDI: with the traditional approach, the smallest mistake on the Photo-tool, required the factory to produce a new one, wasting time and money; however, with LDI, these changes became a matter of updating the design file, which can be done more consistently and cost-effectively.
Orbotech, a worldwide manufacturing company, has about 40 percent of the market share, and ORC Manufacturing and CFMEE both have 10 percent of the market share. Standard and HDI PCB products dominate over 60 percent of the market share by application. China is the largest manufacture region, which has almost 50 percent of the market share.
Market Analysis and Insights: Global Laser Direct Imaging (LDI) Equipment Market
The global Laser Direct Imaging (LDI) Equipment market was valued at US$ 657 million in 2020 and it is expected to reach US$ 739.4 million by the end of 2027, growing at a CAGR of 2.2% during 2021-2027.
Global Laser Direct Imaging (LDI) Equipment Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Laser Direct Imaging (LDI) Equipment Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Polygon Mirror 365nm
DMD 405nm
Segment by Application
Standard and HDI PCB
Thick-Copper and Ceramic PCB
Oversized PCB
Solder Mask
By Company
Orbotech
ORC Manufacturing
CFMEE
Manz
Via Mechanics
YS Photech
SCREEN
Han's CNC
Aiscent
AdvanTools
Limata
Miva
Altix
Delphi Lase
PrintProcess
Production by Region
Japan
Europe
China
North America
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Orbotech, a worldwide manufacturing company, has about 40 percent of the market share, and ORC Manufacturing and CFMEE both have 10 percent of the market share. Standard and HDI PCB products dominate over 60 percent of the market share by application. China is the largest manufacture region, which has almost 50 percent of the market share.
Market Analysis and Insights: Global Laser Direct Imaging (LDI) Equipment Market
The global Laser Direct Imaging (LDI) Equipment market was valued at US$ 657 million in 2020 and it is expected to reach US$ 739.4 million by the end of 2027, growing at a CAGR of 2.2% during 2021-2027.
Global Laser Direct Imaging (LDI) Equipment Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Laser Direct Imaging (LDI) Equipment Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Polygon Mirror 365nm
DMD 405nm
Segment by Application
Standard and HDI PCB
Thick-Copper and Ceramic PCB
Oversized PCB
Solder Mask
By Company
Orbotech
ORC Manufacturing
CFMEE
Manz
Via Mechanics
YS Photech
SCREEN
Han's CNC
Aiscent
AdvanTools
Limata
Miva
Altix
Delphi Lase
PrintProcess
Production by Region
Japan
Europe
China
North America
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
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- By Technology
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The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
