Global Wafer Grinder Market Research Report 2022

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
Market Analysis and Insights: Global Wafer Grinder Market
Due to the COVID-19 pandemic, the global Wafer Grinder market size is estimated to be worth US$ 651.3 million in 2022 and is forecast to a readjusted size of US$ 903.2 million by 2028 with a CAGR of 5.6% during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Wafer Edge Grinder accounting for % of the Wafer Grinder global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Silicon Wafer segment is altered to an % CAGR throughout this forecast period.
The key players of Wafer Grinder include Disco, TOKYO SEIMITSU, etc. The top two players of Wafer Grinder account for approximately 78% of the total market. Asia-Pacific is the largest market of Wafer Grinder accounting for about 75%, followed by Europe and North America. In terms of Type, Wafer Surface Grinder is the largest segment, with a share about 77%. In terms of Application, the largest segment is Silicon Wafer, followed by Sapphire Wafer.
Global Wafer Grinder Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Wafer Grinder Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Wafer Edge Grinder
Wafer Surface Grinder
Segment by Application
Silicon Wafer
SiC Wafer
Sapphire Wafer
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina

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