Global Wafer Grinder Market Insights and Forecast to 2028

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
Market Analysis and Insights: Global Wafer Grinder Market
Due to the COVID-19 pandemic, the global Wafer Grinder market size is estimated to be worth US$ 651.3 million in 2022 and is forecast to a readjusted size of US$ 903.2 million by 2028 with a CAGR of 5.6% during the review period. Fully considering the economic change by this health crisis, Wafer Edge Grinder accounting for % of the Wafer Grinder global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Silicon Wafer segment is altered to an % CAGR throughout this forecast period.
The key players of Wafer Grinder include Disco, TOKYO SEIMITSU, etc. The top two players of Wafer Grinder account for approximately 78% of the total market. Asia-Pacific is the largest market of Wafer Grinder accounting for about 75%, followed by Europe and North America. In terms of Type, Wafer Surface Grinder is the largest segment, with a share about 77%. In terms of Application, the largest segment is Silicon Wafer, followed by Sapphire Wafer.
In terms of production side, this report researches the Wafer Grinder capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Wafer Grinder by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Wafer Grinder Scope and Segment
Wafer Grinder market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Wafer Grinder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Wafer Edge Grinder
Wafer Surface Grinder
Segment by Application
Silicon Wafer
SiC Wafer
Sapphire Wafer
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

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